publicações selecionadas
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artigo académico
- Effect of the IMC layer geometry on a solder joint thermomechanical behavior. Soldering & Surface Mount Technology. 2023
- Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB. Materials. 2021
- The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure. Soldering & Surface Mount Technology. 2020
- The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure. Soldering & Surface Mount Technology. 2020
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documento
- Decoupling of temperature and strain effects on optical fiber-based measurements of thermomechanical loaded printed circuit board assemblies. Buildings. 2023
- Temperature calibration for distributed temperature sensing of printed circuit boards using optical fiber sensors. IEEE Transactions on Components Packaging and Manufacturing Technology. 2023
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livro