Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages Artigo Académico uri icon

autores

  • Polyakov, A.
  • Mendes, P.M.
  • Sinaga, S.M.
  • Bartek, M.
  • Rejaei, B.
  • Correia, J. H.
  • Burghartz, J.N.

data de publicação

  • janeiro 1, 2003