Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives Artigo de Conferência uri icon

autores

  • Mateus Mendes, P.
  • Bartek, M.
  • Polyakov, A.
  • Sinaga, S.M.
  • Mendes, P.M.
  • Correia, J.H.
  • Burghartz, J.N.

data de publicação

  • janeiro 1, 2004