Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: A review Artigo Académico uri icon

autores

  • Carlos Teixeira, José
  • Lau, C.S.
  • Khor, C.Y.
  • Soares, D.
  • Teixeira, J.C.
  • Abdullah, M.Z.

data de publicação

  • janeiro 1, 2016